Arrays The perfect decision for prototypes and small quantities

The clear advantage of ICs on array basis is the fast and economic implementation. Prefabricated wafers, already finished up to the metal layer will be used, only requiring a few additional masks to complete the ASIC. Arrays are often used in batch production, e.g. in aviation and aerospace industry or research & development.

Arrays combine utmost design flexibility and low development costs, which is a major advantage specially for smaller or middle size production - compared to standard cells or full custom designs.


Selection of array datasheets (pdf-files):

H3F-Array
(170 kByte)
H3A-Array (126 kByte)
H3T-Array (95kByte)
K4R-Array (83 kByte)


Different C3 arrays are on stock and allow a fast production of prototype or serial parts. These arrays also allow to manufacture small quantities at low cost.

 

 

 



 

 

 

 

 

 

 

 

 

 


 

Components

 

 

Pads

 

 

NPN    50mA

 

NPN 5/10mA 

 

 

PNP  1mA

lateral

 

PNP   2mA

vertical

 

 

Capacitors

 

Resistors

diffused 

C3A Array  5,5 mm2

18

18

65

33

6

    2 x 5pF

275k

C3B Array  7,0 mm

22

22

87

45

9

3 x 5pF

382k

C3C Array  8,5 mm2

26

26

109

57

12

4 x 5pF

488k

 

 

 

 

Typical delivery times after masking

 

 

< 5 Wafer 

 

> 5 Wafer

Wafer production (Array-Design)

2 weeks

20 weeks

Wafer production (Full-Custom-Design)

20 weeks

20 weeks

Wafer test

2 weeks

 3 weeks

Assembly

4 weeks

4 weeks

Final test 

2 weeks

3 weeks