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Arrays – The perfect decision for prototypes and small quantities
The clear advantage of ICs
on array basis is the fast and economic implementation. Prefabricated
wafers, already finished up to the metal layer will be used, only
requiring a few additional masks to complete the ASIC. Arrays are often
used in batch production, e.g. in aviation and aerospace industry or
research & development.
|
Components
|
Pads
|
NPN 50mA |
NPN 5/10mA
|
PNP 1mA lateral |
PNP 2mA vertical
|
Capacitors |
Resistors diffused |
C3A Array 5,5 mm2 |
18 |
18 |
65 |
33 |
6 |
2 x 5pF |
275k |
C3B Array 7,0 mm2 |
22 |
22 |
87 |
45 |
9 |
3 x 5pF |
382k |
C3C Array 8,5 mm2 |
26 |
26 |
109 |
57 |
12 |
4 x 5pF |
488k |
Typical delivery times after masking
|
< 5 Wafer |
> 5 Wafer |
Wafer production (Array-Design) |
2 weeks |
20 weeks |
Wafer production (Full-Custom-Design) |
20 weeks |
20 weeks |
Wafer test |
2 weeks |
3 weeks |
Assembly |
4 weeks |
4 weeks |
Final test |
2 weeks |
3 weeks |